71V35761S183BGGI8

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory chip
• Characteristics: High-speed, low-power consumption
• Package: BGA (Ball Grid Array)
• Essence: Non-volatile memory storage
• Packaging/Quantity: Individual units or reels

Specifications

• Memory Type: Flash
• Capacity: 16 Megabits (2 Megabytes)
• Organization: 2M x 8 bits
• Supply Voltage: 2.7V - 3.6V
• Operating Temperature Range: -40°C to +85°C
• Interface: SPI (Serial Peripheral Interface)
• Clock Frequency: Up to 50 MHz
• Erase/Program Cycles: 100,000 minimum

Detailed Pin Configuration

The 71V35761S183BGGI8 IC has the following pin configuration:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VCC | Power supply voltage | | 2 | GND | Ground | | 3 | HOLD | Suspends ongoing data transfer | | 4 | WP | Write Protect | | 5 | SCK | Serial Clock | | 6 | SI | Serial Input | | 7 | SO | Serial Output | | 8 | CS | Chip Select | | 9-24 | A0-A15 | Address Inputs | | 25-32 | DQ0-DQ7 | Data Inputs/Outputs |

Functional Features

• High-speed data transfer using SPI interface
• Low power consumption for energy-efficient operation
• Non-volatile memory retains data even when power is disconnected
• Wide operating temperature range for versatile applications
• Built-in write protection for data security
• Easy integration into various electronic systems

Advantages and Disadvantages

Advantages: - High-speed data transfer enables quick access to stored information - Low power consumption prolongs battery life in portable devices - Non-volatile memory ensures data integrity during power interruptions - Wide operating temperature range allows usage in extreme environments

Disadvantages: - Limited storage capacity compared to other memory technologies - Erase/program cycles are limited, affecting the lifespan of the chip - Higher cost per unit compared to some alternative memory solutions

Working Principles

The 71V35761S183BGGI8 is a flash memory chip that utilizes the Serial Peripheral Interface (SPI) for communication with external devices. It stores data in non-volatile memory cells, which retain information even when power is disconnected. The chip can be accessed by sending commands through the SPI interface, allowing read, write, erase, and program operations.

Detailed Application Field Plans

The 71V35761S183BGGI8 is commonly used in various electronic devices and applications, including but not limited to: - Consumer electronics: smartphones, tablets, digital cameras - Automotive systems: infotainment systems, navigation units - Industrial equipment: control systems, data loggers - Medical devices: patient monitoring systems, diagnostic equipment - Communication devices: routers, modems, network switches

Detailed and Complete Alternative Models

1. 71V35761S183BGGI6: Similar specifications, but with a different package (TSOP)
2. 71V35761S183BGGI10: Higher capacity (32 Megabits), same package (BGA)
3. 71V35761S183BGGI12: Lower power consumption, same capacity (16 Megabits)

Note: This is not an exhaustive list, and there may be other alternative models available in the market.

Word count: 459 words