Triode/MOS tube/transistor/module

The SPS series is ON Semiconductor's next generation, fully optimized, ultra-compact integrated MOSFET and driver power stage solution for high current, high frequency, synchronous buck, DC-DC applications. The FDMF5821 features a thermally-managed, ultra-compact 5 mm x 5 mm encapsulation that integrates a driver IC with a bootstrap Schottky diode, two power MOSFETs, and a temperature monitor. The SPS switching power stage is optimized for driver and MOSFET dynamic performance, minimizing system inductance and power MOSFET RDS(ON) using an integrated approach. The SPS series utilizes ON Semiconductor's high-performance PowerTrench MOSFET technology, which reduces switching ringing and eliminates the need for snubber circuits found in most buck converter applications. A driver IC with reduced dead time and propagation delay further enhances performance. A temperature monitor function warns of potential over-temperature conditions. A programmable thermal shutdown feature shuts down the driver if an overtemperature condition occurs. The FDMF5821 incorporates an automatic DCM mode (ZCD#) to improve energy efficiency at light loads. The FDMF5821 also provides a 3-state 5 V PWM input for compatibility with a wide variety of PWM controllers.

IGBT module

Automotive Power MOSFETs for compact and efficient designs mounted in 5x6mm flat lead encapsulation with high thermal performance. Wettable flank options available for enhanced optical detection. AEC-Q101 qualified MOSFETs with Production Part Approval Process (PPAP) capability for automotive applications.

The device is specifically designed as a single encapsulation solution for DC/DC "switching" MOSFETs in cell phones and other ultra-portable applications. It features an independent N-channel and P-channel MOSFETs, both with low on-resistance for lowest conduction losses. The gate charge of each MOSFET is also minimized, allowing high frequency switching directly in the control device. MicroFET 2x2 encapsulation provides excellent thermal performance for its physical size, making it ideal for switching applications.